Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11262381 | Device for positioning a semiconductor die in a wafer prober | Otto A. Torreiter, Jörg Georg Appinger, Martin Eckert | 2022-03-01 |
| 10684930 | Functional testing of high-speed serial links | Martin Eckert, Thomas Gentner, Marta Junginger, Eckhard Kunigkeit, Matthias Pflanz | 2020-06-16 |
| 10114069 | Method for electrical testing of a 3-D chip stack | Martin Eckert, Eckhard Kunigkeit, Otto A. Torreiter | 2018-10-30 |
| 10056346 | Chip attach frame | Martin Eckert, Otto A. Torreiter | 2018-08-21 |
| 9977053 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-05-22 |
| 9927463 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-03-27 |
| 9921268 | Auto-alignment of backer plate for direct docking test boards | Eberhard Dengler, Gabriele Kuczera, Eckhard Kunigkeit, Siegfried Tomaschko | 2018-03-20 |
| 9891272 | Module testing utilizing wafer probe test equipment | Martin Eckert, Eckhard Kunigkeit, Christian Zoellin | 2018-02-13 |
| 9885748 | Module testing utilizing wafer probe test equipment | Martin Eckert, Eckhard Kunigkeit, Christian Zoellin | 2018-02-06 |
| 9726719 | Semiconductor automatic test equipment | Gabriele Kuczera, Eckhard Kunigkeit | 2017-08-08 |
| 9686895 | Chip attach frame | Martin Eckert, Otto A. Torreiter | 2017-06-20 |
| 9496188 | Soldering three dimensional integrated circuits | Martin Eckert, Eckhard Kunigkeit, Otto A. Torreiter | 2016-11-15 |
| 9250289 | System for electrical testing and manufacturing of a 3-D chip stack and method | Martin Eckert, Eckhard Kunigkeit, Otto A. Torreiter | 2016-02-02 |
| 8535956 | Chip attach frame | Martin Eckert, Otto A. Torreiter | 2013-09-17 |