Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Xiao Li, Shijian Luo +3 more | 2023-02-28 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Xiao Li, Shijian Luo +3 more | 2020-08-11 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Xiao Li, Shijian Luo +3 more | 2019-01-01 |
| 9735136 | Method for embedding silicon die into a stacked package | Jonathon G. Greenwood | 2017-08-15 |
| 9711494 | Methods of fabricating semiconductor die assemblies | Luke England, Michel Koopmans | 2017-07-18 |
| 9379091 | Semiconductor die assemblies and semiconductor devices including same | Luke England, Michel Koopmans | 2016-06-28 |
| 9153520 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Xiao Li, Shijian Luo +3 more | 2015-10-06 |
| 8937309 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Michel Koopmans | 2015-01-20 |
| 8832631 | Integrated circuit apparatus, systems, and methods | — | 2014-09-09 |
| 8828798 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Michel Koopmans | 2014-09-09 |
| 8552567 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Luke England, Michel Koopmans | 2013-10-08 |
| 8499271 | Integrated circuit apparatus, systems, and methods | — | 2013-07-30 |
| 8472232 | Self-identifying stacked die semiconductor components | — | 2013-06-25 |
| 8245176 | Integrated circuit apparatus, systems, and methods | — | 2012-08-14 |
| 8144497 | Self-identifying stacked die semiconductor components | — | 2012-03-27 |
| 8001513 | Integrated circuit apparatus, systems, and methods | — | 2011-08-16 |
| 7898901 | Method for controlling clock cycle time for reduced power consumption in a semiconductor memory device | Debra M. Bell | 2011-03-01 |
| 7795903 | Output buffer and method having a supply voltage insensitive slew rate | Dong Pan | 2010-09-14 |
| 7729197 | Memory device having a delay locked loop with frequency control | Debra M. Bell | 2010-06-01 |
| 7573733 | Self-identifying stacked die semiconductor components | — | 2009-08-11 |
| 7528624 | Output buffer and method having a supply voltage insensitive slew rate | Dong Pan | 2009-05-05 |
| 7489587 | Semiconductor memory device capable of controlling clock cycle time for reduced power consumption | Debra M. Bell | 2009-02-10 |
| 7408822 | Alignment of memory read data and clocking | — | 2008-08-05 |
| 7332946 | Power supply voltage detection circuitry and methods for use of the same | Dong Pan, Feng Lin | 2008-02-19 |
| 7327592 | Self-identifying stacked die semiconductor components | — | 2008-02-05 |