PM

Paul V. Miller

Applied Materials: 5 patents #2,165 of 7,310Top 30%
SE Sensarray: 1 patents #5 of 14Top 40%
Microsoft: 1 patents #24,826 of 40,388Top 65%
Overall (All Time): #653,579 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8125654 Methods and apparatus for measuring substrate edge thickness during polishing Dominic J. Benvegnu, Boguslaw A. Swedek, Sen-Hou Ko, Abraham Ravid 2012-02-28
8001101 Presenting instant answers to internet queries Christopher Walter Anderson, Edward D. Harris, Ravi Aringunram, Ajay Nair, Vishal Singh 2011-08-16
7951718 Edge removal of silicon-on-insulator transfer wafer Raymond John Donohoe, Krishna Vepa, Ronald Rayandayan, Hong Wang 2011-05-31
7695982 Refurbishing a wafer having a low-k dielectric layer Hong Wang, Krishna Vepa 2010-04-13
7402520 Edge removal of silicon-on-insulator transfer wafer Raymond John Donohoe, Krishna Vepa, Ronald Rayandayan, Hong Wang 2008-07-22
7208325 Refreshing wafers having low-k dielectric materials Hong Wang, Krishna Vepa 2007-04-24
6954711 Test substrate reclamation method and apparatus Israel Beinglass 2005-10-11
6325536 Integrated wafer temperature sensors Wayne G. Renken, Mei Sun, Roy Gordon, Peter Michael Noel Vandenabeele 2001-12-04