Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7423337 | Integrated circuit device package having a support coating for improved reliability during temperature cycling | Viraj A. Patwardhan, Hau Nguyen, Shahram Mostafazadeh | 2008-09-09 |
| 7413927 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages | Viraj A. Patwardhan, Hau Nguyen | 2008-08-19 |
| 7301222 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages | Viraj A. Patwardhan, Hau Nguyen | 2007-11-27 |
| 7253078 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Hau Nguyen, Viraj A. Patwardhan, Shahram Mostafazadeh | 2007-08-07 |
| 6607941 | Process and structure improvements to shellcase style packaging technology | Ashok S. Prabhu, Anindya Poddar | 2003-08-19 |
| 6352881 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Christopher Quentin, Ashok S. Prabhu, Hem Takiar | 2002-03-05 |
| 6238949 | Method and apparatus for forming a plastic chip on chip package module | Luu Thanh Nguyen, Ashok S. Prabhu, Hem Takiar | 2001-05-29 |