Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035979 | Printed wiring board with built-in semiconductor element, and process for producing the same | Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Minoru Enomoto, Masakatsu Goto +2 more | 2011-10-11 |
| 7894200 | Printed wiring board with built-in semiconductor element, and process for producing the same | Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Minoru Enomoto, Masakatsu Goto +2 more | 2011-02-22 |
| 6306481 | Multilayer circuit board having insulating layer with via-holes | Satoru Amou, Masao Suzuki, Tokihito Suwa, Akio Takahashi, Masanori Nemoto +4 more | 2001-10-23 |
| 6190834 | Photosensitive resin composition, and multilayer printed circuit board using the same | Masatoshi Narahara, Tokihito Suwa, Masao Suzuki, Satoru Amou, Akio Takahashi +4 more | 2001-02-20 |
| 5914216 | Multilayer circuit board and photosensitive resin composition used therefor | Satoru Amou, Masao Suzuki, Tokihito Suwa, Akio Takahashi, Masanori Nemoto +4 more | 1999-06-22 |
| 5849460 | Photosensitive resin composition and method for using the same in manufacture of circuit boards | Yoshinori Kawai, Junichi Katagiri, Masanori Nemoto, Akio Takahashi | 1998-12-15 |
| 5712080 | Method for manufacturing printed circuit board | Yuichi Satsu, Haruo Akahoshi, Akio Takahashi, Masashi Miyazaki, Toshiaki Ishimaru | 1998-01-27 |
| 5476690 | Process for preparing printed circuit board | Fumihiko Ohta, Takeshi Nojiri, Shinji Tsuchikawa, Akio Nakano, Toshiaki Ishimaru +3 more | 1995-12-19 |
| 5356698 | Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same | Haruo Akahoshi, Akio Takahashi, Akio Mukoh, Kazuo Tanje, Toyofusa Yoshimura +3 more | 1994-10-18 |
| 5139923 | Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon | Ritsuji Toba, Kanji Murakami | 1992-08-18 |
| 5028513 | Process for producing printed circuit board | Kanji Murakami, Akio Tadokoro, Haruo Akahoshi, Toshikazu Narahara, Ritsuji Toba +3 more | 1991-07-02 |
| 4876177 | Process for producing printed circuit board | Haruo Akahoshi, Kanji Murakami, Akio Tadokoro, Toyofusa Yoshimura | 1989-10-24 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Haruo Akahoshi, Kanji Murakami, Akio Takokoro, Ritsuji Toba, Toyofusa Yoshimura | 1989-09-12 |
| 4820549 | Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition | Kiyoshi Ozaki, Atsushi Mori, Hideo Tsuda, Kanji Murakami, Motoyo Wajima | 1989-04-11 |
| 4632852 | Process for electroless copper plating | Haruo Akahoshi, Kanji Murakami, Motoyo Wajima, Rituji Toba, Shoji Kawakubo +1 more | 1986-12-30 |
| 4610910 | Printed circuit board, process for preparing the same and resist ink used therefor | Kanji Murakami, Haruo Akahoshi, Yoichi Matsuda, Motoyo Wajima, Makoto Matsunaga +4 more | 1986-09-09 |
| 4604160 | Method for manufacture of printed wiring board | Kanji Murakami, Haruo Akahoshi, Motoyo Wajima, Yoichi Matsuda, Kyoji Kawakubo +3 more | 1986-08-05 |
| 4457952 | Process for producing printed circuit boards | Kanji Murakami, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima, Hirosada Morishita +2 more | 1984-07-03 |
| 4378384 | Process for producing printed circuit board by electroless plating | Kanji Murakami, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima, Shoji Kawakubo +1 more | 1983-03-29 |
| 4293592 | Method for production of printed circuits by electroless metal plating | Hirosada Morishita, Kanzi Murakami | 1981-10-06 |
| 4239813 | Process for forming printed wiring by electroless deposition | Kanji Murakami, Yoichi Matsuda, Motoyo Wajima, Hirosada Morishita | 1980-12-16 |