Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9493605 | Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product | — | 2016-11-15 |
| 9090796 | Organic-inorganic composite materials containing triazine rings and electrical devices using the same | Tomokazu Tanase, Hiroyuki Kagawa | 2015-07-28 |
| 9034475 | Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same | Tomiya Abe, Daisuke SHANAI, Hiroaki Komatsu, Kenichi Murakami | 2015-05-19 |
| 9028970 | Adhesive composition, varnish, adhesive film and wiring film | Tomiya Abe, Daisuke SHANAI, Hiroaki Komatsu, Kenichi Murakami | 2015-05-12 |
| 8735724 | Electric equipment having insulation structure at welding parts | Takahito MURAKI | 2014-05-27 |
| 8685872 | Low softening point glass composition, bonding material using same and electronic parts | Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Keiichi Kanazawa +3 more | 2014-04-01 |
| 8507592 | Adhesive composition, adhesive film and wiring film using the same | Kosuke Kuwabara, Tomiya Abe, Hiroaki Komatsu, Kenichi Murakami | 2013-08-13 |
| 8470723 | Low softening point glass composition, bonding material using same and electronic parts | Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Keiichi Kanazawa +3 more | 2013-06-25 |
| 8420210 | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof | Morimichi Umino, Akira Nagai, Yoshihiro Nakamura, Nobuyuki Minami | 2013-04-16 |
| 8227361 | Prepreg and printed wiring board using thin quartz glass cloth | Hiroshi Shimizu, Akinori Hanawa | 2012-07-24 |
| 8115105 | Prepreg and its application products for low thermal expansion and low dielectric tangent | Hiroshi Shimizu, Akinori Hanawa | 2012-02-14 |
| 8097545 | Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition | Haruo Akahoshi, Hiroshi Shimizu, Akinori Hanawa | 2012-01-17 |
| 7638564 | Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish | Haruo Akahoshi, Yoshihiro Nakamura, Nobuyuki Minami, Yasuhiro Murai | 2009-12-29 |
| 7375155 | Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof | Shinji Yamada, Takao Ishikawa, Takao Miwa | 2008-05-20 |
| 7294905 | Thin film capacitor and electronic circuit component | Masahiko Ogino, Toshiya Satoh, Takao Miwa, Toshihide Nabatame | 2007-11-13 |
| 7273900 | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof | Morimichi Umino, Akira Nagai, Yoshihiro Nakamura, Nobuyuki Minami | 2007-09-25 |
| 7193009 | Electronic device using low dielectric loss tangent insulators for high frequency signals | Akira Nagai, Shinji Yamada, Takao Ishikawa, Akio Takahashi | 2007-03-20 |
| 7112627 | Low dielectric loss tangent films and wiring films | Shinji Yamada, Takao Ishikawa, Akira Nagai, Masatoshi Sugimasa | 2006-09-26 |
| 6930140 | Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof | Shinji Yamada, Takao Ishikawa, Takao Miwa | 2005-08-16 |
| 6855952 | Semiconductor device and semiconductor package | Akira Nagai, Shinji Yamada, Takao Ishikawa, Hiroshi Nakano | 2005-02-15 |
| 6756441 | Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof | Shinji Yamada, Takao Ishikawa, Takao Miwa | 2004-06-29 |
| 6306481 | Multilayer circuit board having insulating layer with via-holes | Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto +4 more | 2001-10-23 |
| 6190834 | Photosensitive resin composition, and multilayer printed circuit board using the same | Masatoshi Narahara, Mineo Kawamoto, Tokihito Suwa, Masao Suzuki, Akio Takahashi +4 more | 2001-02-20 |
| 5914216 | Multilayer circuit board and photosensitive resin composition used therefor | Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto +4 more | 1999-06-22 |
| 5565536 | Polymerizable compouund, process for producing same and setting composition containing polymerizable compound | Shin Nishimura, Yoshinori Kawai, Akira Nagai, Masahiro Suzuki, Akio Takahashi +1 more | 1996-10-15 |