Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Jacques Leibovitz, Park-Kee Yu, Ya Yun Zhu, Susan Swindlehurst, Cheng-Cheng Chang +1 more | 2000-01-04 |
| 5399528 | Multi-layer fabrication in integrated circuit systems | Jacques Leibovitz, Kenneth D. Scholz, Clinton Chao | 1995-03-21 |
| 5221421 | Controlled etching process for forming fine-geometry circuit lines on a substrate | Jacques Leibovitz, Daniel J. Miller, John P. Scalia, Howard H. Nakano, Voddarahalli K. Nagesh +1 more | 1993-06-22 |
| 5200300 | Methods for forming high density multi-chip carriers | Jacques Leibovitz, Kenneth D. Scholz, Clinton Chao | 1993-04-06 |
| 5162260 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Kenneth D. Scholz, Clinton Chao | 1992-11-10 |
| 5055425 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Kenneth D. Scholz, Clinton Chao | 1991-10-08 |