Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048964 | Bonding material and bonding method using same | Minami Kanasugi, Hideyuki Fujimoto, Satoru Kurita | 2024-07-30 |
| 11453053 | Joining material and joining method using same | Satoru Kurita, Tatsuro Hori, Hiromasa Miyoshi | 2022-09-27 |
| 10903185 | Bonding material and bonding method using same | Koichi Yuzaki, Minami Nagaoka, Hiromasa Miyoshi, Satoru Kurita | 2021-01-26 |
| 10821558 | Bonding material and bonding method using same | Hiromasa Miyoshi, Kimikazu Motomura, Satoru Kurita | 2020-11-03 |
| 10543569 | Bonding material and bonding method using same | Satoru Kurita, Takashi Hinotsu, Hiromasa Miyoshi | 2020-01-28 |
| 10328534 | Bonding material and bonding method using same | Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa | 2019-06-25 |
| 10090275 | Bonding method using bonding material | Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama | 2018-10-02 |
| 10008471 | Bonding material and bonding method using the same | Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama | 2018-06-26 |
| 9662748 | Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method | Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno | 2017-05-30 |
| 9533380 | Bonding material and bonding method in which said bonding material is used | Satoru Kurita, Minami Nagaoka | 2017-01-03 |
| 9486879 | Bonding material and bonding body, and bonding method | Satoru Kurita, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama | 2016-11-08 |
| 9240256 | Bonding material and bonding method using the same | Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama | 2016-01-19 |
| 8858700 | Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method | Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama | 2014-10-14 |
| 8641929 | Low-temperature-sinterable bonding material, and bonding method using the bonding material | Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama | 2014-02-04 |