| 12324143 |
Methods of utilizing etch-stop material during fabrication of capacitors, integrated assemblies comprising capacitors |
Sanh D. Tang, Christopher W. Petz, Pankaj Sharma, Yong Yang |
2025-06-03 |
| 10436717 |
Compositional optical emission spectroscopy for detection of particle induced arcs in a fabrication process |
Thomas R. Omstead, Deepak Vedhachalam |
2019-10-08 |
| 8884433 |
Circuitry component and method for forming the same |
Mou-Shiung Lin, Chien-Kang Chou |
2014-11-11 |
| 8558383 |
Post passivation structure for a semiconductor device and packaging process for same |
Mou-Shiung Lin, Chien-Kang Chou |
2013-10-15 |
| 8399989 |
Metal pad or metal bump over pad exposed by passivation layer |
Mou-Shiung Lin, Hsin-Jung Lo, Chiu-Ming Chou, Chien-Kang Chou |
2013-03-19 |
| 8304766 |
Semiconductor chip with a bonding pad having contact and test areas |
Mou-Shiung Lin, Huei-Mei Yen, Hsin-Jung Lo, Chiu-Ming Chou |
2012-11-06 |
| 8294279 |
Chip package with dam bar restricting flow of underfill |
Shih-Hsiung Lin, Mou-Shiung Lin |
2012-10-23 |
| 8148822 |
Bonding pad on IC substrate and method for making the same |
Mou-Shiung Lin, Hsin-Jung Lo, Chiu-Ming Chou, Chien-Kang Chou |
2012-04-03 |
| 7947978 |
Semiconductor chip with bond area |
Mou-Shiung Lin, Huei-Mei Yen, Chiu-Ming Chou, Hsin-Jung Lo |
2011-05-24 |
| 7582556 |
Circuitry component and method for forming the same |
Mou-Shiung Lin, Chien-Kang Chou |
2009-09-01 |
| 7468545 |
Post passivation structure for a semiconductor device and packaging process for same |
Mou-Shiung Lin, Chien-Kang Chou |
2008-12-23 |
