HY

Huei-Mei Yen

ME Megica: 2 patents #22 of 32Top 70%
Overall (All Time): #2,098,472 of 4,157,543Top 55%
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Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8304766 Semiconductor chip with a bonding pad having contact and test areas Mou-Shiung Lin, Hsin-Jung Lo, Chiu-Ming Chou, Ke-Hung Chen 2012-11-06
7947978 Semiconductor chip with bond area Mou-Shiung Lin, Chiu-Ming Chou, Hsin-Jung Lo, Ke-Hung Chen 2011-05-24