Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6504105 | Solder ball connections and assembly process | John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, David P. Watson +1 more | 2003-01-07 |
| 5825629 | Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment | Eric M. Hubacher, Julian Partridge | 1998-10-20 |
| 5762259 | Method for forming bumps on a substrate | Eric M. Hubacher | 1998-06-09 |
| 5758413 | Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias | Ku Ho Chong, Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Michael G. McMaster | 1998-06-02 |
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure | Ku Ho Chong, Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Michael G. McMaster | 1997-12-23 |
| 5675889 | Solder ball connections and assembly process | John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr. +1 more | 1997-10-14 |
| 5591941 | Solder ball interconnected assembly | John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, David P. Watson +1 more | 1997-01-07 |
| 5492266 | Fine pitch solder deposits on printed circuit board process and product | Eric M. Hubacher, Julian Partridge | 1996-02-20 |
| 5147084 | Interconnection structure and test method | John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Bruno T. Klingel +1 more | 1992-09-15 |
| 5060844 | Interconnection structure and test method | John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Bruno T. Klingel +1 more | 1991-10-29 |
| 4998342 | Method of attaching electronic components | Ralph E. Bonnell, George C. Castello | 1991-03-12 |
| 4919970 | Solder deposition control | John Stankus | 1990-04-24 |
| 4761881 | Single step solder process | Muhammad-Yusuf J. Bora | 1988-08-09 |