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IC chip uniform delayering methods |
Keith E. Barton, Thomas A. Bauer, Stanley J. Klepeis, Yun-Yu Wang |
2009-03-17 |
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Chromium adhesion layer for copper vias in low-k technology |
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Method for producing crack-resistant high strength superalloy articles |
John J. Schirra, Robert W. Hatala |
1996-06-18 |
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Styrene-isoprene-styrene block copolymer composition and adhesives made |
Steven S. Chin, Ramsis Gobran |
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Method of producing turbine disks |
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