| 10141274 |
Semiconductor chip with anti-reverse engineering function |
Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Patrick S. Spinney, Anna Tilley |
2018-11-27 |
| 9893023 |
Semiconductor chip with anti-reverse engineering function |
Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Patrick S. Spinney, Anna Tilley |
2018-02-13 |
| 9708508 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Matthew T. Tiersch, Eva A. Shah +1 more |
2017-07-18 |
| 9711464 |
Semiconductor chip with anti-reverse engineering function |
Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Patrick S. Spinney, Anna Tilley |
2017-07-18 |
| 9057004 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Matthew T. Tiersch, Eva A. Shah +1 more |
2015-06-16 |
| 8734665 |
Slurry for chemical-mechanical polishing of copper and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Eva A. Shah, Matthew T. Tiersch +1 more |
2014-05-27 |
| 7572739 |
Tape removal in semiconductor structure fabrication |
Steven R. Codding, Timothy C. Krywanczyk, Steven G. Perrotte |
2009-08-11 |
| 7442552 |
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging |
Joseph K. V. Comeau, Adele M. Mahoney, Gerald J. Scilla, Charles H. Wilson |
2008-10-28 |
| 7300796 |
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging |
Joseph K. V. Comeau, Adele M. Mahoney, Gerald J. Scilla, Charles H. Wilson |
2007-11-27 |
