| 9510461 |
Electric component module and method of manufacturing the same |
Il Hyeong LEE, Seung-yong Choi |
2016-11-29 |
| 9048199 |
Semiconductor package and method of manufacturing the semiconductor package |
Do Jae Yoo |
2015-06-02 |
| 8842438 |
3D power module package |
Tae Hoon Kim, Seog Moon Choi |
2014-09-23 |
| 8779580 |
Electronic component package and manufacturing method thereof |
Joon Seok Kang, Sung Yi, Do Jae Yoo, Sun-Kyong Kim, Jong Hwan Baek |
2014-07-15 |
| 8410465 |
Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor |
Seung Seoup Lee, In Kyung Park |
2013-04-02 |
| 8054370 |
Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof |
Min Kyo Cho, Young-Shin Kwon |
2011-11-08 |
| 7696004 |
Wafer level package fabrication method |
Jingli Yuan, Si Joong Yang, In-goo Kang, Seung Wook Park |
2010-04-13 |
| 7683476 |
Semiconductor package film having reinforcing member and related display module |
Si-Hoon Lee, Sa-Yoon Kang |
2010-03-23 |
| 7670878 |
Method for manufacturing semiconductor package |
Jing Li Yuan, Tae Hoon Kim, Si Joong Yang, Seung Wook Park |
2010-03-02 |
| 7659936 |
Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof |
Min Kyo Cho, Young-Shin Kwon |
2010-02-09 |
| 7484901 |
Image sensor camera module and method of fabricating the same |
Byoung-Rim Seo, Yung-Cheol Kong, Seok-Won Lee |
2009-02-03 |
