Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704350 | Stacked wafer level package and method of manufacturing the same | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Ju Pyo Hong, Hee Kon Lee +2 more | 2014-04-22 |
| 7670878 | Method for manufacturing semiconductor package | Jae-Cheon Doh, Tae Hoon Kim, Si Joong Yang, Seung Wook Park | 2010-03-02 |