Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8857047 | Thin foil semiconductor package | Nghia Thuc Tu, Will K. Wong, David Chin | 2014-10-14 |
| 8747640 | Foil plating for semiconductor packaging | Nghia Thuc Tu, Will K. Wong | 2014-06-10 |
| 8679896 | DC/DC converter power module package incorporating a stacked controller and construction methodology | Rajeev Joshi, Ashok S. Prabhu | 2014-03-25 |
| 8450149 | Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology | James D. Broiles | 2013-05-28 |
| 8377267 | Foil plating for semiconductor packaging | Nghia Thuc Tu, Will K. Wong | 2013-02-19 |
| 8375577 | Method of making foil based semiconductor package | Will K. Wong, Nghia Thuc Tu, David Chin | 2013-02-19 |
| 8341828 | Thin foil semiconductor package | Nghia Thuc Tu, Will K. Wong, David Chin | 2013-01-01 |
| 8298871 | Method and leadframe for packaging integrated circuits | Will K. Wong, Nghia Thuc Tu | 2012-10-30 |
| 8293573 | Microarray package with plated contact pedestals | Nghia Thuc Tu | 2012-10-23 |
| 8222716 | Multiple leadframe package | — | 2012-07-17 |
| 8101470 | Foil based semiconductor package | Anindya Poddar, Nghia Thuc Tu, Will K. Wong, David Chin | 2012-01-24 |
| 7944032 | Integrated circuit package with molded insulation | — | 2011-05-17 |
| 7923825 | Integrated circuit package | Anindya Poddar | 2011-04-12 |
| 7893523 | Microarray package with plated contact pedestals | Nghia Thuc Tu | 2011-02-22 |
| 7859090 | Die attach method and leadframe structure | Nghia Thuc Tu, Lim Fong, Chan Peng Yeen | 2010-12-28 |
| 7836586 | Thin foil semiconductor package | Nghia Thuc Tu, Will K. Wong, David Chin | 2010-11-23 |
| 7705476 | Integrated circuit package | Anindya Poddar | 2010-04-27 |
| 7678617 | Universal laminator | — | 2010-03-16 |
| 7671452 | Microarray package with plated contact pedestals | Nghia Thuc Tu | 2010-03-02 |
| 7619303 | Integrated circuit package | — | 2009-11-17 |
| 7612435 | Method of packaging integrated circuits | Anindya Poddar | 2009-11-03 |
| 7608482 | Integrated circuit package with molded insulation | — | 2009-10-27 |
| 7598122 | Die attach method and microarray leadframe structure | Nghia Thuc Tu, Lim Fong, Chan Peng Yeen | 2009-10-06 |
| 7491625 | Gang flipping for IC packaging | Nghia Thuc Tu, Anindya Poddar, Ashok S. Prabhu | 2009-02-17 |
| 7432583 | Leadless leadframe package substitute and stack package | Felix C. Li | 2008-10-07 |