HW

Huey-Ming Wang

MI Multiplanar Technologies Incorporated: 7 patents #3 of 11Top 30%
Globalfoundries: 5 patents #673 of 4,424Top 20%
EI Ebara Technologies Incorporated: 4 patents #1 of 16Top 7%
RH Rodel Holdings: 3 patents #34 of 95Top 40%
MM Mitsubishi Materials: 1 patents #812 of 1,543Top 55%
Overall (All Time): #223,632 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9349814 Gate height uniformity in semiconductor devices Tsung-Liang Chen, Hung-Wei Liu, Rohit Pal, Hsin-Neng Tai, Tae Hoon Lee +2 more 2016-05-24
9257516 Reduction of oxide recesses for gate height control Tsung-Liang Chen, Hsin-Neng Tai 2016-02-09
9093560 Gate height uniformity in semiconductor devices Tsung-Liang Chen, Hung-Wei Liu, Rohit Pal, Hsin-Neng Tai, Tae Hoon Lee +2 more 2015-07-28
8927356 Removal of nitride bump in opening replacement gate structure Tsung-Liang Chen, Hsin-Neng Tai, Puneet Khanna 2015-01-06
8877580 Reduction of oxide recesses for gate height control Tsung-Liang Chen, Hsin-Neng Tai 2014-11-04
7326103 Vertically adjustable chemical mechanical polishing head and method for use thereof Kunihiko Sakurai, Gerard Moloney, Jun Liu, Peter Lao 2008-02-05
7004822 Chemical mechanical polishing and pad dressing method Gerard Moloney, Peter Lao 2006-02-28
6966822 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2005-11-22
6916226 Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof Gerard Moloney 2005-07-12
6913514 Chemical mechanical polishing endpoint detection system and method Norio Kimura, Masayuki Kumekawa 2005-07-05
6893327 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface Jiro Kajiwara, Gerard Moloney, Junsheng Yang 2005-05-17
6641461 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal David A. Hansen, Gerard Moloney, Jiro Kajiwara 2003-11-04
6623343 System and method for CMP head having multi-pressure annular zone subcarrier material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-09-23
6558232 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-05-06
6540590 Chemical mechanical polishing apparatus and method having a rotating retaining ring Jiro Kajiwara 2003-04-01
6506105 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2003-01-14
6309290 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control Gerard Moloney, Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey 2001-10-30
6001269 Method for polishing a composite comprising an insulator, a metal, and titanium Anantha R. Sethuraman, Lee Melbourne Cook, Guangwei Wu 1999-12-14
5770103 Composition and method for polishing a composite comprising titanium Guangwei Wu, Lee Melbourne Cook 1998-06-23
5693239 Polishing slurries comprising two abrasive components and methods for their use Jiun-Fang Wang, Anantha R. Sethuraman, Lee Melbourne Cook 1997-12-02