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Gate height uniformity in semiconductor devices |
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2016-05-24 |
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Reduction of oxide recesses for gate height control |
Tsung-Liang Chen, Hsin-Neng Tai |
2016-02-09 |
| 9093560 |
Gate height uniformity in semiconductor devices |
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2015-07-28 |
| 8927356 |
Removal of nitride bump in opening replacement gate structure |
Tsung-Liang Chen, Hsin-Neng Tai, Puneet Khanna |
2015-01-06 |
| 8877580 |
Reduction of oxide recesses for gate height control |
Tsung-Liang Chen, Hsin-Neng Tai |
2014-11-04 |
| 7326103 |
Vertically adjustable chemical mechanical polishing head and method for use thereof |
Kunihiko Sakurai, Gerard Moloney, Jun Liu, Peter Lao |
2008-02-05 |
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Chemical mechanical polishing and pad dressing method |
Gerard Moloney, Peter Lao |
2006-02-28 |
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System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes |
2005-11-22 |
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Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof |
Gerard Moloney |
2005-07-12 |
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Chemical mechanical polishing endpoint detection system and method |
Norio Kimura, Masayuki Kumekawa |
2005-07-05 |
| 6893327 |
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
Jiro Kajiwara, Gerard Moloney, Junsheng Yang |
2005-05-17 |
| 6641461 |
Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal |
David A. Hansen, Gerard Moloney, Jiro Kajiwara |
2003-11-04 |
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Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes |
2003-09-23 |
| 6558232 |
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes |
2003-05-06 |
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Jiro Kajiwara |
2003-04-01 |
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Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes |
2003-01-14 |
| 6309290 |
Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
Gerard Moloney, Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey |
2001-10-30 |
| 6001269 |
Method for polishing a composite comprising an insulator, a metal, and titanium |
Anantha R. Sethuraman, Lee Melbourne Cook, Guangwei Wu |
1999-12-14 |
| 5770103 |
Composition and method for polishing a composite comprising titanium |
Guangwei Wu, Lee Melbourne Cook |
1998-06-23 |
| 5693239 |
Polishing slurries comprising two abrasive components and methods for their use |
Jiun-Fang Wang, Anantha R. Sethuraman, Lee Melbourne Cook |
1997-12-02 |