Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385128 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, Sell Jung, HeeSoo Lee | 2025-08-12 |
| 12374559 | Double-sided partial molded SiP module | Gwang Kim, Junho Ye | 2025-07-29 |
| 12304122 | Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulant | Kyunghwan KIM | 2025-05-20 |
| 12266614 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2025-04-01 |
| 12211803 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | Gwang Kim, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2025-01-28 |
| 12211808 | Semiconductor device and method of forming discrete antenna modules | Choon Heung Lee, Junho Ye | 2025-01-28 |
| 12136759 | Antenna-in-package devices and methods of making | KyoungHee Park, Kyunghwan KIM, Seunghyun Lee, Sangjun Park | 2024-11-05 |
| 12046564 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2024-07-23 |
| 11990424 | Selective EMI shielding using preformed mask | Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung +3 more | 2024-05-21 |
| 11935777 | Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support | HyeonChul LEE, HyunSu TAK, Wanil Lee, InHo SEO | 2024-03-19 |
| 11932933 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, Sell Jung, HeeSoo Lee | 2024-03-19 |
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | Gwang Kim, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |
| 11887863 | Double-sided partial molded SIP module | Gwang Kim, Junho Ye | 2024-01-30 |
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
| 11735539 | Semiconductor device and method of forming discrete antenna modules | Choon Heung Lee, Junho Ye | 2023-08-22 |
| 11676911 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2023-06-13 |
| 11664327 | Selective EMI shielding using preformed mask | Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung +3 more | 2023-05-30 |
| 11652088 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, Sungsoo Kim, HeeSoo Lee | 2023-05-16 |
| 11587882 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2023-02-21 |
| 11434561 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, Sell Jung, HeeSoo Lee | 2022-09-06 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HeeSoo Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | DeokKyung Yang, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, InSang Yoon | 2022-04-19 |
| 11244908 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2022-02-08 |
| 11189598 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, Sungsoo Kim, HeeSoo Lee | 2021-11-30 |