Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964615 | Chip-scale sensor package structure | LI-CHUN HUNG, CHIEN-CHEN LEE | 2021-03-30 |
| 10825851 | Sensor package structure | Sheng-Shu Yang, LI-CHUN HUNG, Jo-Wei Yang, CHIEN-CHEN LEE, Jian-Ru Chen | 2020-11-03 |
| 10720370 | Sensor package structure | Jian-Ru Chen, Jo-Wei Yang, Chung-Hsien Hsin | 2020-07-21 |
| 10700111 | Optical sensor | LI-CHUN HUNG, CHIEN-CHEN LEE | 2020-06-30 |
| 10692917 | Sensor package structure | Chung-Hsien Hsin, Jian-Ru Chen | 2020-06-23 |
| 10600830 | Sensor package structure | Jian-Ru Chen, Jo-Wei Yang, LI-CHUN HUNG, Chung-Hsien Hsin | 2020-03-24 |
| 10340250 | Stack type sensor package structure | Jian-Ru Chen, Jo-Wei Yang, LI-CHUN HUNG | 2019-07-02 |
| 10236313 | Sensor package structure | Chung-Hsien Hsin, Jian-Ru Chen | 2019-03-19 |
| 10186538 | Sensor package structure | Chung-Hsien Hsin, Jian-Ru Chen | 2019-01-22 |
| 10170508 | Optical package structure | Chung-Hsien Hsin, Jina-Ru Chen | 2019-01-01 |
| 9184331 | Method for reducing tilt of optical unit during manufacture of image sensor | Chun-Hua Chuang, Chien-Wei Chang, Chen Peng, Chung-Hsien Hsin, Chun-Lung Huang +4 more | 2015-11-10 |
| 8969120 | Two-stage packaging method of image sensors | Chun-Lung Huang, Cheng-Chang Wu, Chung-Yu Yang, Rong Wang, Jo-Wei Yang | 2015-03-03 |
| 8928104 | Image sensor packaging structure with black encapsulant | Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2015-01-06 |
| 8847146 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more | 2014-09-30 |
| 8828777 | Wafer level image sensor packaging structure and manufacturing method of the same | Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu +2 more | 2014-09-09 |
| 8703519 | Structure and manufacturing method for high resolution camera module | Chun-Lung Huang, Cheng-Chang Wu, Chung-Yu Yang, Rong Wang, Jo-Wei Yang | 2014-04-22 |
| 8563350 | Wafer level image sensor packaging structure and manufacturing method for the same | Han-Hsing Chen, Chung-Hsien Hsin, Ming-Hui Chen | 2013-10-22 |
| 8481343 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2013-07-09 |
| 8440488 | Manufacturing method and structure for wafer level image sensor module with fixed focal length | Han-Hsing Chen, Chung-Hsien Hsin, Ming-Hui Chen | 2013-05-14 |
| 8441086 | Image sensor packaging structure with predetermined focal length | Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2013-05-14 |
| 8390087 | Image sensor package structure with large air cavity | Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu +2 more | 2013-03-05 |
| 8378441 | Manufacturing method and structure of a wafer level image sensor module with package structure | Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu +2 more | 2013-02-19 |
| 8093674 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof | Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more | 2012-01-10 |
| 7554599 | Image sensor module with air escape hole and a method for manufacturing the same | Mon Ho, Jason Chuang, Chen Peng, Chung-Hsien Hsin, Wei-Lin Chang | 2009-06-30 |
| 7423334 | Image sensor module with a protection layer and a method for manufacturing the same | Chen Peng, Mon Ho, Chung-Hsien Hsin | 2008-09-09 |