Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7420809 | Heat spreader in integrated circuit package | Maurice Othieno, Qwai H. Low | 2008-09-02 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages | Maurice Othieno, Qwai H. Low | 2007-06-26 |
| 6897555 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Wee Liew, Chengyu Guo | 2005-05-24 |
| 6687133 | Ground plane on 2 layer PBGA | Wee Liew, Chengyu Guo | 2004-02-03 |
| 6555914 | Integrated circuit package via | Aritharan Thurairajaratnam, Pradip D. Patel, Manickam Thavarajah | 2003-04-29 |