Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6060795 | Semiconductor power pack | James K. Azotea, Steve Arthur | 2000-05-09 |
| 5577656 | Method of packaging a semiconductor device | Victor A. K. Temple | 1996-11-26 |
| 5473193 | Package for parallel subelement semiconductor devices | Victor A. K. Temple, Donald L. Watrous | 1995-12-05 |
| 5446316 | Hermetic package for a high power semiconductor device | Victor A. K. Temple | 1995-08-29 |
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Kyung Wook Paik, James G. McMullen | 1994-04-19 |
| 5209390 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess | 1993-05-11 |
| 5206186 | Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding | Constantine A. Neugebauer, Kyung Wook Paik, James G. McMullen | 1993-04-27 |
| 5184206 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Kyung Wook Paik, James G. McMullen, Martha M. Neugebauer | 1993-02-02 |
| 5166773 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess | 1992-11-24 |
| 5135890 | Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess | 1992-08-04 |
| 5133795 | Method of making a silicon package for a power semiconductor device | — | 1992-07-28 |
| 5105536 | Method of packaging a semiconductor chip in a low inductance package | Constantine A. Neugebauer, Robert J. Satriano, James F. Burgess, Victor A. K. Temple, Donald L. Watrous | 1992-04-21 |
| 5103290 | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess | 1992-04-07 |
| 5100740 | Direct bonded symmetric-metallic-laminate/substrate structures | Constantine A. Neugebauer, James F. Burgess | 1992-03-31 |
| 5034044 | Method of bonding a silicon package for a power semiconductor device | — | 1991-07-23 |
| 5028987 | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip | Constantine A. Neugebauer, Robert J. Satriano, James F. Burgess, Victor A. K. Temple, Donald L. Watrous | 1991-07-02 |
| 4939101 | Method of making direct bonded wafers having a void free interface | Robert D. Black, Stephen Daley Arthur, Robert S. Gilmore | 1990-07-03 |
| 4921415 | Cure monitoring apparatus having high temperature ultrasonic transducers | Lewis J. Thomas, III, Robert S. Gilmore | 1990-05-01 |
| 4901136 | Multi-chip interconnection package | Constantine A. Neugebauer, Lionel M. Levinson, Charles W. Eichelberger, Robert J. Wojnarowski, Richard O. Carlson | 1990-02-13 |
| 4828597 | Flexible glass fiber mat bonding method | Richard O. Carlson | 1989-05-09 |
| 4825117 | Temperature compensated piezoelectric transducer assembly | Lewis J. Thomas, III, Robert S. Gilmore | 1989-04-25 |
| 4803450 | Multilayer circuit board fabricated from silicon | James F. Burgess, Harold F. Webster, Constantine A. Neugebauer, James A. Loughran | 1989-02-07 |
| 4745455 | Silicon packages for power semiconductor devices | Harold F. Webster, Constantine A. Neugebauer, Fadel A. Selim, David L. Mueller, Dante E. Piccone | 1988-05-17 |
| 4574299 | Thyristor packaging system | Constantine A. Neugebauer, Harold F. Webster | 1986-03-04 |
| 4541035 | Low loss, multilevel silicon circuit board | Richard O. Carlson, James A. Loughran, Harold F. Webster | 1985-09-10 |