HO

Hidetaka Oshio

Applied Materials: 8 patents #1,541 of 7,310Top 25%
Overall (All Time): #613,496 of 4,157,543Top 15%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12183578 Method for forming and patterning a layer and/or substrate Takehito Koshizawa, Rui Cheng, Tejinder Singh 2024-12-31
12112949 Highly etch selective amorphous carbon film Rajesh Prasad, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Harry Whitesell +4 more 2024-10-08
12014927 Highly etch selective amorphous carbon film Rajesh Prasad, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Harry Whitesell +4 more 2024-06-18
11527408 Multiple spacer patterning schemes Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya +5 more 2022-12-13
11469107 Highly etch selective amorphous carbon film Rajesh Prasad, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Harry Whitesell +4 more 2022-10-11
11315787 Multiple spacer patterning schemes Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya +5 more 2022-04-26
11145509 Method for forming and patterning a layer and/or substrate Takehito Koshizawa, Rui Cheng, Tejinder Singh 2021-10-12
10727059 Highly etch selective amorphous carbon film Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Rajesh Prasad, Kwangduk Douglas Lee, Harry Whitesell +2 more 2020-07-28