Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418919 | Leadless chip carrier having improved mountability | Roelf Anco Jacob Groenhuis, Markus Björn Erik Noren, Fei Ying Wong | 2016-08-16 |
| 7494924 | Method for forming reinforced interconnects on a substrate | On Lok Chau, Gor Lai, Heng Keong Yip, Thoon Khin Chang, Lan Chu Tan | 2009-02-24 |
| 7422973 | Method for forming multi-layer bumps on a substrate | On Lok Chau, Gor Lai | 2008-09-09 |
| 7279409 | Method for forming multi-layer bumps on a substrate | On Lok Chau, Gor Lai | 2007-10-09 |
| 7262494 | Three-dimensional package | On Lok Chau, Fei Ying Wong | 2007-08-28 |
| 7205178 | Land grid array packaged device and method of forming same | Kam Lee, Ho Wong | 2007-04-17 |
| 7112871 | Flipchip QFN package | Wai Wong Chow, Qing-Chun He | 2006-09-26 |
| 7056766 | Method of forming land grid array packaged device | Wai Wong Chow, Nan Xu | 2006-06-06 |
| 6905910 | Method of packaging an optical sensor | Wai Wong Chow, Kam Lee | 2005-06-14 |
| 6867072 | Flipchip QFN package and method therefor | Wai Wong Chow, Qing-Chun He | 2005-03-15 |