Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406899 | Semiconductor package system | — | 2025-09-02 |
| 12167312 | Electronic device and operating method | Yongchul Choi, Jungcheon Choi | 2024-12-10 |
| 11908758 | Semiconductor package including dual stiffener | Junso Pak, Heeseok Lee | 2024-02-20 |
| 11908810 | Hybrid semiconductor device and electronic device | Junso Pak, Heeseok Lee | 2024-02-20 |
| 11658090 | Semiconductor package system | — | 2023-05-23 |
| 11600607 | Semiconductor module including multiple power management semiconductor packages | — | 2023-03-07 |
| 11244885 | Semiconductor package system | — | 2022-02-08 |
| 11075138 | Semiconductor package system | — | 2021-07-27 |
| 11069623 | Semiconductor package | — | 2021-07-20 |
| 10991638 | Semiconductor package system | — | 2021-04-27 |
| 10198049 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Jae Choon Kim, Eunseok Cho, Jichul Kim | 2019-02-05 |
| 10068881 | Package-on-package type semiconductor package and method of fabricating the same | — | 2018-09-04 |
| 9859237 | Chip using triple pad configuration and packaging method thereof | Inhyuk Kim | 2018-01-02 |
| 9698088 | Semiconductor packages | Kang Joon LEE, Jaewook Yoo, Su-chang Lee | 2017-07-04 |
| 9606591 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Jae Choon Kim, Eunseok Cho, Jichul Kim | 2017-03-28 |
| 9390992 | Semiconductor packages including a metal layer between first and second semiconductor chips | Sangho An | 2016-07-12 |
| 9214441 | Semiconductor package including stacked memory chips | Kyoungmook Lim | 2015-12-15 |
| 8981543 | Semiconductor package and method of forming the same | Seungjin Cheon | 2015-03-17 |
| 8952517 | Package-on-package device and method of fabricating the same | Jeongoh HA | 2015-02-10 |
| 8709879 | Method of forming a semiconductor package | Ji Hyun Park, Min-Ok Na, Taehwan Kim | 2014-04-29 |
| 8426959 | Semiconductor package and method of manufacturing the same | Ji Hyun Park, Min-Ok Na, Taehwan Kim | 2013-04-23 |