Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776946 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Tea-Geon Kim, Bubryong Lee, Junglae Jung | 2023-10-03 |
| 10998303 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Tea-Geon Kim, Bubryong Lee, Junglae Jung | 2021-05-04 |
| 9881814 | Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the same | — | 2018-01-30 |
| 8981543 | Semiconductor package and method of forming the same | Heungkyu Kwon | 2015-03-17 |