Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776946 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee | 2023-10-03 |
| 10998303 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee | 2021-05-04 |