Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658326 | Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire | Won-Gil Han, Yong Je Lee, Jae-heung Lee, Seungweon Ha | 2020-05-19 |
| 9881827 | Substrate treating apparatus and substrate treating method | Geunwoo KIM, Seunghee Lee, Hyun Joo Kim, Ohchul Kwon, Seonju Oh +1 more | 2018-01-30 |
| 9390992 | Semiconductor packages including a metal layer between first and second semiconductor chips | Heungkyu Kwon | 2016-07-12 |