| 9708508 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah +1 more |
2017-07-18 |
| 9348057 |
Method and apparatus for calibrating sensors that detect wafer protrusion from a wafer cassette |
John J. Bandy, Bradley M. Mahan |
2016-05-24 |
| 9221241 |
Apparatus and method for removing a CMP pad from a platen |
John J. Bandy, Jeffery A. Brigante |
2015-12-29 |
| 9057004 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah +1 more |
2015-06-16 |
| 8734665 |
Slurry for chemical-mechanical polishing of copper and use thereof |
Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Eva A. Shah, Matthew T. Tiersch +1 more |
2014-05-27 |
| 8715460 |
Apparatus and method for removing a CMP pad from a platen |
John J. Bandy, Jeffery A. Brigante |
2014-05-06 |
| 8637403 |
Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics |
Yoba Amoah, Joseph P. Hasselbach, Thomas L. McDevitt, Eva A. Shah |
2014-01-28 |
| 8210904 |
Slurryless mechanical planarization for substrate reclamation |
David Domina, James L. Hardy, Eric J. White |
2012-07-03 |
| 8088690 |
CMP method |
Thomas L. McDevitt, Eva A. Shah, Matthew T. Tiersch, Eric J. White |
2012-01-03 |
