Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362343 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Choon Heung Lee | 2025-07-15 |
| 12327812 | Semiconductor device and manufacturing method thereof | Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim | 2025-06-10 |
| 12205827 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder | 2025-01-21 |
| 11916033 | Method and system for packing optimization of semiconductor devices | Daniel Richter | 2024-02-27 |
| 11901332 | Semiconductor device and manufacturing method thereof | Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim | 2024-02-13 |
| 11817434 | Displays with embedded light emitters | Christopher Bower, Matthew Meitl, Justin Walker Brown, Ronald S. Cok | 2023-11-14 |
| 11799061 | Displays with unpatterned layers of light-absorbing material | Christopher Bower, Matthew Meitl, Ronald S. Cok | 2023-10-24 |
| 11742471 | Surface-mountable pixel packages and pixel engines | Christopher Bower, Matthew Meitl, Justin Walker Brown | 2023-08-29 |
| 11569425 | Surface-mountable pixel packages and pixel engines | Christopher Bower, Matthew Meitl, Justin Walker Brown | 2023-01-31 |
| 11315909 | Displays with embedded light emitters | Christopher Bower, Matthew Meitl, Justin Walker Brown, Ronald S. Cok | 2022-04-26 |
| 11239192 | Method and system for packing optimization of semiconductor devices | Daniel Richter | 2022-02-01 |
| 11183493 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Choon Heung Lee | 2021-11-23 |
| 11127889 | Displays with unpatterned layers of light-absorbing material | Christopher Bower, Matthew Meitl, Ronald S. Cok | 2021-09-21 |
| 11094870 | Surface-mountable pixel packages and pixel engines | Christopher Bower, Matthew Meitl, Justin Walker Brown | 2021-08-17 |
| 11031370 | Semiconductor device and manufacturing method thereof | Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim | 2021-06-08 |
| 10832921 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder | 2020-11-10 |
| 10734343 | Method and system for packing optimization of semiconductor devices | Daniel Richter | 2020-08-04 |
| 10483222 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Eun Sook Sohn, In Bae Park, Won Chul Do | 2019-11-19 |
| 10410993 | Manufacturing method of semiconductor device and semiconductor device thereof | Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim | 2019-09-10 |
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Choon Heung Lee | 2019-08-20 |
| 10304697 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder | 2019-05-28 |
| 10157872 | Semiconductor device and method of manufacturing thereof | Greg Hames, Devarajan Balaraman | 2018-12-18 |
| 10115705 | Semiconductor package and manufacturing method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim +3 more | 2018-10-30 |
| 10056349 | Manufacturing method of semiconductor device and semiconductor device thereof | Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim | 2018-08-21 |
| 10037957 | Semiconductor device and method of manufacturing thereof | Greg Hames, Devarajan Balaraman | 2018-07-31 |