| 7052973 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone |
Jack H. Linn, William H. Speece, Michael G. Shlepr |
2006-05-30 |
| 6909146 |
Bonded wafer with metal silicidation |
Jack H. Linn, Robert K. Lowry, James F. Buller |
2005-06-21 |
| 6825532 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone |
Jack H. Linn, William H. Speece, Michael G. Shlepr |
2004-11-30 |
| 6812108 |
BICMOS process with low temperature coefficient resistor (TCRL) |
Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Anthony L. Rivoli, Michael D. Church +2 more |
2004-11-02 |
| 6798024 |
BiCMOS process with low temperature coefficient resistor (TCRL) |
Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Anthony L. Rivoli, Michael D. Church +2 more |
2004-09-28 |
| 6455379 |
Power trench transistor device source region formation using silicon spacer |
Linda S. Brush, Jun Zeng, John J. Hackenberg, Jack H. Linn |
2002-09-24 |
| 6255195 |
Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method |
Jack H. Linn, William H. Speece, Michael G. Shlepr |
2001-07-03 |
| 6246090 |
Power trench transistor device source region formation using silicon spacer |
Linda S. Brush, Jun Zeng, John J. Hackenberg, Jack H. Linn |
2001-06-12 |
| 5932022 |
SC-2 based pre-thermal treatment wafer cleaning process |
Jack H. Linn, Sana Rafie, Roberta R. Nolan-Lobmeyer, Diana L. Hackenberg, Steven T. Slasor +1 more |
1999-08-03 |
| 5849627 |
Bonded wafer processing with oxidative bonding |
Jack H. Linn, Robert K. Lowry, James F. Buller |
1998-12-15 |
| 5744852 |
Bonded wafer |
Jack H. Linn, George Bajor |
1998-04-28 |
| 5603779 |
Bonded wafer and method of fabrication thereof |
Jack H. Linn, George Bajor |
1997-02-18 |
| 5569620 |
Bonded wafer processing with metal silicidation |
Jack H. Linn, Robert K. Lowry, James F. Buller |
1996-10-29 |
| 5517047 |
Bonded wafer processing |
Jack H. Linn, Robert K. Lowry, James F. Buller, William H. Speece |
1996-05-14 |
| 5387555 |
Bonded wafer processing with metal silicidation |
Jack H. Linn, Robert K. Lowry, James F. Buller |
1995-02-07 |
| 5362667 |
Bonded wafer processing |
Jack H. Linn, Robert K. Lowry, James F. Buller, William H. Speece |
1994-11-08 |
| 5334273 |
Wafer bonding using trapped oxidizing vapor |
John P. Short, Craig J. McLachlan, James R. Zibrida |
1994-08-02 |
| 5266135 |
Wafer bonding process employing liquid oxidant |
John P. Short, Craig J. McLachlan, James R. Zibrida |
1993-11-30 |
| 5240876 |
Method of fabricating SOI wafer with SiGe as an etchback film in a BESOI process |
Stephen Joseph Gaul |
1993-08-31 |
| 5218213 |
SOI wafer with sige |
Stephen Joseph Gaul |
1993-06-08 |
| 5091331 |
Ultra-thin circuit fabrication by controlled wafer debonding |
Jose Avelino Delgado, Stephen Joseph Gaul, Craig J. McLachlan |
1992-02-25 |
| 5081061 |
Manufacturing ultra-thin dielectrically isolated wafers |
Paul S. Reinecke |
1992-01-14 |
| 5034343 |
Manufacturing ultra-thin wafer using a handle wafer |
Paul S. Reinecke, Craig J. McLachlan |
1991-07-23 |
| 4968628 |
Method of fabricating back diffused bonded oxide substrates |
Jose Avelino Delgado, Stephen Joseph Gaul, Craig J. McLachlan |
1990-11-06 |
| 4851078 |
Dielectric isolation process using double wafer bonding |
John P. Short |
1989-07-25 |
