| 6963129 |
Multi-chip package having a contiguous heat spreader assembly |
Thomas R. Evans, Stan Mihelcic, Leah M. Miller, Kumar Nagarajan |
2005-11-08 |
| 6867488 |
Thick metal top layer |
— |
2005-03-15 |
| 6828643 |
Bonding pads over input circuits |
— |
2004-12-07 |
| 6798035 |
Bonding pad for low k dielectric |
Qwai H. Low, Ramaswamy Ranganathan |
2004-09-28 |
| 6791177 |
Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate |
Leah M. Miller, Aritharan Thurairajaratnam |
2004-09-14 |
| 6762366 |
Ball assignment for ball grid array package |
Leah M. Miller, Farshad Ghahghahi |
2004-07-13 |
| 6744130 |
Isolated stripline structure |
Leah M. Miller, Aritharan Thurairajaratnam |
2004-06-01 |
| 6671865 |
High density input output |
Anwar Ali, Farshad Ghahghahi |
2003-12-30 |
| 6459049 |
High density signal routing |
Leah M. Miller, Farshad Ghahghahi, Aritharan Thurairajaratnam |
2002-10-01 |
| 6008534 |
Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
— |
1999-12-28 |
| 5729894 |
Method of assembling ball bump grid array semiconductor packages |
Michael D. Rostoker, Mark R. Schneider |
1998-03-24 |
| 5686764 |
Flip chip package with reduced number of package layers |
— |
1997-11-11 |
| 5648661 |
Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies |
Michael D. Rostoker, Carlos Dangelo, James S. Koford |
1997-07-15 |
| 5311060 |
Heat sink for semiconductor device assembly |
Michael D. Rostoker, Mark R. Schneider |
1994-05-10 |
