Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239336 | Integrated circuit structure with niobium-based silicide layer and methods to form same | Wei Hong, Yanping Shen, Hong Yu | 2022-02-01 |
| 11187852 | Bragg gratings with silicide-coated segments | Yusheng Bian, Roderick A. Augur, Michal Rakowski | 2021-11-30 |
| 10319633 | Diffusion barrier layer formation | Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2019-06-11 |
| 10192822 | Modified tungsten silicon | Kriteshwar K. Kohli, Siddarth A. Krishnan, Joseph F. Shepard, Jr., Keith Kwong Hon Wong | 2019-01-29 |
| 10170359 | Diffusion barrier layer formation | Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2019-01-01 |
| 10096609 | Modified tungsten silicon | Nicolas L. Breil, Keith Kwong Hon Wong | 2018-10-09 |
| 9859403 | Multiple step thin film deposition method for high conformality | Nicolas L. Breil, Neal A. Makela, Praneet Adusumilli | 2018-01-02 |
| 9847251 | Diffusion barrier layer formation | Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2017-12-19 |
| 9691658 | Contact fill in an integrated circuit | Emre Alptekin, Raghu Mangu, Cung D. Tran | 2017-06-27 |
| 9633946 | Seamless metallization contacts | Jim Shih-Chun Liang, Kathryn T. Schonenberg, Shahrukh Khan, Wei-Tsu Tseng | 2017-04-25 |
| 9406554 | Diffusion barrier layer formation | Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2016-08-02 |
| 9293365 | Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing | Jim Shih-Chun Liang, Joyeeta Nag, Wei-Tsu Tseng, George S. Tulevski | 2016-03-22 |
| 9224675 | Automatic capacitance tuning for robust middle of the line contact and silicide applications | Patrick W. DeHaven, Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2015-12-29 |