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Ultraviolet energy curable tape and method of making a semiconductor chip using the tape |
Timothy C. Krywanczyk, Steven A. Martel, Matthew R. Whalen |
2012-04-24 |
| 7902682 |
Ultraviolet energy curable tape and method of making a semiconductor chip using the tape |
Timothy C. Krywanczyk, Steven A. Martel, Matthew R. Whalen |
2011-03-08 |
| 7288465 |
Semiconductor wafer front side protection |
Allan D. Abrams, Joseph Danaher, Timothy C. Krywanczyk, Rene Lamothe, Ivan Stone +1 more |
2007-10-30 |
| 7134933 |
Wafer thickness control during backside grind |
Thomas G. Ference, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson |
2006-11-14 |
| 7074715 |
Use of photoresist in substrate vias during backside grind |
Joseph Danaher, Timothy C. Krywanczyk, Amye L. Wells |
2006-07-11 |
| 7001827 |
Semiconductor wafer front side protection |
Allan D. Abrams, Joseph Danaher, Timothy C. Krywanczyk, Rene Lamothe, Ivan Stone +1 more |
2006-02-21 |
| 6915795 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson |
2005-07-12 |
| 6888223 |
Use of photoresist in substrate vias during backside grind |
Joseph Danaher, Timothy C. Krywanczyk, Amye L. Wells |
2005-05-03 |
| 6887126 |
Wafer thickness control during backside grind |
Thomas G. Ference, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson |
2005-05-03 |
| 6600213 |
Semiconductor structure and package including a chip having chamfered edges |
Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson |
2003-07-29 |
| 6368881 |
Wafer thickness control during backside grind |
Thomas G. Ference, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson |
2002-04-09 |
| 6328794 |
Method of controlling stress in a film |
Timothy C. Krywanczyk, Jerome B. Lasky, Rick L. Mohler, Wolfgang Rauscher |
2001-12-11 |
| 6271102 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson |
2001-08-07 |
| 6171873 |
Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information |
Ronald L. Mendelson, Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, John Blondin |
2001-01-09 |
| 6153536 |
Method for mounting wafer frame at back side grinding (BSG) tool |
Ronald L. Mendelson |
2000-11-28 |
| 5913125 |
Method of controlling stress in a film |
Timothy C. Krywanczyk, Jerome B. Lasky, Rick L. Mohler, Wolfgang Rauscher |
1999-06-15 |
| 5888838 |
Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information |
Ronald L. Mendelson, Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, John Blondin |
1999-03-30 |
