Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266614 | Molded laser package with electromagnetic interference shield and method of making | HunTeak Lee, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2025-04-01 |
| 12046564 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, HeeSoo Lee | 2024-07-23 |
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
| 11676911 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, HeeSoo Lee | 2023-06-13 |
| 11670618 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2023-06-06 |
| 11652088 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | HunTeak Lee, Sungsoo Kim, HeeSoo Lee | 2023-05-16 |
| 11587882 | Molded laser package with electromagnetic interference shield and method of making | HunTeak Lee, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2023-02-21 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11244908 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, HeeSoo Lee | 2022-02-08 |
| 11189598 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | HunTeak Lee, Sungsoo Kim, HeeSoo Lee | 2021-11-30 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | HunTeak Lee, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2021-03-02 |
| 10797024 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2020-10-06 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10790268 | Semiconductor device and method of forming a 3D integrated system-in-package module | HunTeak Lee, HeeSoo Lee | 2020-09-29 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2020-06-30 |
| 10636765 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2020-04-28 |
| 10636774 | Semiconductor device and method of forming a 3D integrated system-in-package module | HunTeak Lee, HeeSoo Lee | 2020-04-28 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | HunTeak Lee, Sungsoo Kim, HeeSoo Lee | 2019-11-05 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2019-08-20 |
| 10083903 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | In Sang Yoon, Sungmin Song | 2018-09-25 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |