Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tomohiro Uno, Tetsuya OYAMADA, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Tetsuya OYAMADA, Yuya SUTO +1 more | 2025-06-10 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Takashi Yamada, Motoki ETO, Teruo Haibara, Tomohiro Uno | 2025-05-13 |
| 12290883 | Bonding wire | Motoki ETO, Ryo OISHI | 2025-05-06 |
| 12166006 | Bonding wire for semiconductor devices | Tomohiro Uno, Tetsuya OYAMADA, Motoki ETO | 2024-12-10 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-09-17 |
| 11929343 | Bonding wire for semiconductor devices | Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2024-03-12 |
| 11721660 | Bonding wire for semiconductor devices | Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2023-08-08 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Motoki ETO, Takumi Ohkabe | 2023-03-28 |
| 11373934 | Bonding wire for semiconductor device | Takashi Yamada, Motoki ETO, Teruo Haibara, Tomohiro Uno | 2022-06-28 |
| 11342299 | Bonding wire for semiconductor devices | Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |
| 11101234 | Cu pillar cylindrical preform for semiconductor connection | Takashi Yamada, Teruo Haibara, Shinichi Terashima | 2021-08-24 |
| 10991672 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2021-04-27 |
| 10985130 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2021-04-20 |
| 10950571 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada, Motoki ETO | 2021-03-16 |
| 10840208 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-11-17 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-09-29 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2020-06-02 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-04-07 |
| 10529683 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-01-07 |
| 10497663 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2019-12-03 |