DL

Dan S. LAVRIC

IN Intel: 11 patents #3,700 of 30,777Top 15%
Overall (All Time): #435,808 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12402387 Integrated circuit structures including a titanium silicide material Glenn A. Glass, Thomas T. TROEGER, Suresh Vishwanath, Jitendra Kumar Jha, John F. Richards +2 more 2025-08-26
12310060 Gate-all-around integrated circuit structures having uniform threshold voltages and tight gate endcap tolerances Dax M. Crum, David J. TOWNER, Orb Acton, Jitendra Kumar Jha, YenTing CHIU +3 more 2025-05-20
12295170 Fabrication of gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer Dax M. Crum, Omair Saadat, Oleg Golonzka, Tahir Ghani 2025-05-06
12113068 Fabrication of gate-all-around integrated circuit structures having additive metal gates Dax M. Crum, Omair Saadat, Oleg Golonzka, Tahir Ghani 2024-10-08
12051698 Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer Daniel G. Ouellette, Daniel B. O'Brien, Jeffrey S. Leib, Orb Acton, Lukas Baumgartel +3 more 2024-07-30
12046654 Integrated circuit structures including a titanium silicide material Glenn A. Glass, Thomas T. TROEGER, Suresh Vishwanath, Jitendra Kumar Jha, John F. Richards +2 more 2024-07-23
11984506 Field effect transistor having a gate dielectric with a dipole layer and having a gate stressor layer Vishal Tiwari, Rishabh Mehandru, Michal Mleczko, Szuya S. Liao 2024-05-14
11476164 Integrated circuit structures having differentiated workfunction layers Ying-Feng PANG, Florian Gstrein, Ashish Agrawal, Robert Niffenegger, Padmanava Sadhukhan +2 more 2022-10-18
11018222 Metallization in integrated circuit structures Daniel B. O'Brien, Christopher J. Wiegand, Lukas Baumgartel, Oleg Golonzka, Daniel Bergstrom +3 more 2021-05-25
6846752 Methods and devices for the suppression of copper hillock formation Stephen Chambers 2005-01-25
6818548 Fast ramp anneal for hillock suppression in copper-containing structures Stephen Chambers 2004-11-16