| 7858273 |
Method of forming a mask design having advanced oriented assist features for integrated circuit hole patterns |
— |
2010-12-28 |
| 7686909 |
Reel-type package of flexible printed circuit boards and method for supplying thereof |
Ping-Chin Cheng, Sheng-Hsiung Ho |
2010-03-30 |
| 7575852 |
Method of optically transferring a pattern from a mask having advanced oriented assist features for integrated circuit hole patterns |
— |
2009-08-18 |
| 7525139 |
Image sensor with a protection layer |
Wen-Kun Yang, Wen Yang, Wen-Bin Sun, Chao-Nan Chou, His-Ying Yuan +1 more |
2009-04-28 |
| 7400037 |
Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP |
Wen-Kun Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao, His-Ying Yuan +1 more |
2008-07-15 |
| 7279782 |
FBGA and COB package structure for image sensor |
Wen-Kun Yang, Wen-Bin Sun, Jui-Hsien Chang, Chun-Hui Yu, His-Ying Yuan |
2007-10-09 |
| 7258322 |
Manually operated switch for a faucet |
— |
2007-08-21 |
| 7142262 |
Liquid crystal display module |
Hui-Chang Chen |
2006-11-28 |
| 7061117 |
Bump layout on silicon chip |
Wen-Chih Yang, Feng-Cheng Su |
2006-06-13 |
| 6994951 |
Method of fabricating a stamper by half-tone technology |
Irene Chen, Tien-Yu Chou, Jyh-Huei Lay, Yuan Wang, Jo-Wen Wu +1 more |
2006-02-07 |
| 6844629 |
Display panel with bypassing lines |
Shan-Te Chen, Chih-Sung Wang, Sheng-Lun Su, Ke-Feng Lin |
2005-01-18 |
| 6608382 |
Metal bump |
I-Ming Liu, Hong Chen |
2003-08-19 |
| 6556268 |
Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB |
Yu-Chi Lee, Hong-Yu Lin, Fang I. Shieh |
2003-04-29 |
| 6373545 |
Repairable TFT-LCD assembly and method for making in which a separation tape positioned between two anisotropic conductive films |
Fang I. Shieh, Hong-Yu Lin, Yu-Chi Lee, Chi Yuan Wu, Su-Yu Fun |
2002-04-16 |
| 5927881 |
Multiple-shaft pen kit |
— |
1999-07-27 |
| D399873 |
Pen |
— |
1998-10-20 |
| D393000 |
Pen |
— |
1998-03-31 |
| D392315 |
Pen |
— |
1998-03-17 |
| 5632319 |
Method for manufacturing environmentally conscious foamed aluminum materials |
Shan-Chang Chueh, Kou-Chang Su, Ting Chiou |
1997-05-27 |