Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406847 | Microelectronic devices and related methods of fabricating microelectronic devices | Andrew M. Bayless | 2025-09-02 |
| 12251841 | Apparatuses for handling microelectronic devices | Kuan Wei Tseng | 2025-03-18 |
| 12148727 | Semiconductor device assembly with die support structures | David R. Hembree | 2024-11-19 |
| 12100661 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Andrew M. Bayless | 2024-09-24 |
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Andrew M. Bayless | 2024-09-10 |
| 12087720 | Semiconductor device assembly with surface-mount die support structures | Benjamin L. McClain | 2024-09-10 |
| 11961818 | Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems | Andrew M. Bayless | 2024-04-16 |
| 11955345 | Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems | Liang Chen | 2024-04-09 |
| 11911904 | Apparatus and methods for enhanced microelectronic device handling | Kuan Wei Tseng | 2024-02-27 |
| 11908828 | Contaminant control in thermocompression bonding of semiconductors and associated systems and methods | Jaekyu Song, Sui Chi Huang | 2024-02-20 |
| 11791212 | Thin die release for semiconductor device assembly | Andrew M. Bayless | 2023-10-17 |
| 11784092 | Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing | Andrew M. Bayless | 2023-10-10 |
| 11784050 | Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus | Andrew M. Bayless | 2023-10-10 |
| 11776908 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Andrew M. Bayless | 2023-10-03 |
| 11764096 | Method for semiconductor die edge protection and semiconductor die separation | Andrew M. Bayless | 2023-09-19 |
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Andrew M. Bayless | 2023-08-01 |
| 11705425 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Zhaohui Ma | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Benjamin L. McClain, Jeremy E. Minnich, Zhaohui Ma | 2023-06-06 |
| 11646269 | Recessed semiconductor devices, and associated systems and methods | Andrew M. Bayless | 2023-05-09 |
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Xiaopeng Qu, Hyunsuk Chun, Andrew M. Bayless | 2022-11-29 |
| 11410964 | Contaminant control in thermocompression bonding of semiconductors and associated systems and methods | Jaekyu Song, Sui Chi Huang | 2022-08-09 |
| 11410961 | Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies | Andrew M. Bayless | 2022-08-09 |
| 11289360 | Methods and apparatus for protection of dielectric films during microelectronic component processing | Andrew M. Bayless, Wei Zhou | 2022-03-29 |
| 11189590 | Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies | Andrew M. Bayless | 2021-11-30 |
| 11189609 | Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices | Andrew M. Bayless | 2021-11-30 |