Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8242378 | Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder mass | Ahmed Amin, Frank Baiocchi, John M. DeLucca, John W. Osenbach | 2012-08-14 |
| 8013428 | Whisker-free lead frames | Kultaransingh N. Hooghan, John W. Osenbach, Brian Dale Potteiger, Poopa Ruengsinsub, Richard Shook +1 more | 2011-09-06 |
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Ahmed Amin, David Crouthamel, John W. Osenbach, Thomas H. Shilling | 2011-07-19 |
| 7727781 | Manufacture of devices including solder bumps | Joze E. Antol, Kishor Desai, John W. Osenbach | 2010-06-01 |
| 7671436 | Electronic packages | Ahmed Amin, Mark A. Bachman, David Crouthamel, John W. Osenbach | 2010-03-02 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads | John W. Osenbach, Brian Dale Potteiger, Richard Shook | 2008-05-06 |