| 6812049 |
Method and system for performing failure analysis on a multilayer silicon-on-insulator (SOI) device |
— |
2004-11-02 |
| 6770512 |
Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections |
Mehrdad Mahanpour, Mohammad Masoodi |
2004-08-03 |
| 6534869 |
Method for reducing stress-induced voids for 0.25 &mgr;m micron and smaller semiconductor chip technology by annealing interconnect lines prior to ILD deposition and semiconductor chip made thereby |
Paul R. Besser, Minh Van Ngo |
2003-03-18 |
| 6011619 |
Semiconductor wafer optical scanning system and method using swath-area defect limitation |
Paul J. Steffan, Ming Chen |
2000-01-04 |
| 5882738 |
Apparatus and method to improve electromigration performance by use of amorphous barrier layer |
Richard C. Blish, II |
1999-03-16 |
| 5864199 |
Electron beam emitting tungsten filament |
Roger Alvis, Janice Gray |
1999-01-26 |
| 5847821 |
Use of fiducial marks for improved blank wafer defect review |
Donald L. Wollesen |
1998-12-08 |
| 5770519 |
Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device |
Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more |
1998-06-23 |
| 5727978 |
Method of forming electron beam emitting tungsten filament |
Roger Alvis, Janice Gray |
1998-03-17 |
| 5713667 |
Temperature sensing probe for microthermometry |
Roger Alvis, Andrew Norman Erickson, Ayesha R. Raheem Kizchery, Jeremias D. Romero |
1998-02-03 |
| 5646448 |
Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device |
Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more |
1997-07-08 |
| 5639691 |
Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device |
Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more |
1997-06-17 |