| 6300235 |
Method of forming multi-level coplanar metal/insulator films using dual damascene with sacrificial flowable oxide |
Klaus Feldner, Virinder Grewal, Rainer Florian Schnabel |
2001-10-09 |
| 5798301 |
Method of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliability |
Pei-Ing Lee, Darryl D. Restaino, Bill Klaasen |
1998-08-25 |
| 5641992 |
Metal interconnect structure for an integrated circuit with improved electromigration reliability |
Pei-Ing Lee, Darryl D. Restaino, Bill Klaasen |
1997-06-24 |
| 5529670 |
Method of depositing conductors in high aspect ratio apertures under high temperature conditions |
James G. Ryan, David C. Strippe |
1996-06-25 |
| 5262354 |
Refractory metal capped low resistivity metal conductor lines and vias |
William J. Cote, Pei-Ing Lee, Thomas E. Sandwick, Victor Vynorius, Stuart H. Wolff |
1993-11-16 |
