Issued Patents All Time
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374641 | Sealed bonded structures and methods for forming the same | Rajesh Katkar, Laura Wills Mirkarimi | 2025-07-29 |
| 12272673 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2025-04-08 |
| 12266650 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2025-04-01 |
| 12113056 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2024-10-08 |
| 12100684 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2024-09-24 |
| 11866831 | Methods for wet atomic layer etching of copper | Christopher NETZBAND, Paul Abel, Jacques Faguet | 2024-01-09 |
| 11837596 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2023-12-05 |
| 11670615 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2023-06-06 |
| 11658173 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2023-05-23 |
| 11610846 | Protective elements for bonded structures including an obstructive element | Belgacem Haba, Javier A. Delacruz, Rajesh Katkar | 2023-03-21 |
| 11495579 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2022-11-08 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2022-04-12 |
| 11056390 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen | 2021-07-06 |
| 10879226 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2020-12-29 |
| 10879210 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-12-29 |
| 10879207 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-12-29 |
| 10811388 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2020-10-20 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Guilian Gao | 2020-04-14 |
| 10600760 | Ultrathin layer for forming a capacitive interface between joined integrated circuit component | Belgacem Haba | 2020-03-24 |
| 10546832 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2020-01-28 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen | 2020-01-14 |
| 10522499 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2019-12-31 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10446456 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2019-10-15 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2019-10-08 |