| 7288492 |
Method for forming interconnects on thin wafers |
Leonard Gardecki, James R. Palmer, Erik M. Probstfield |
2007-10-30 |
| 7138326 |
Wafer integrated rigid support ring |
Harry D. Cox, David Daniel, Leonard Gardecki, Albert Gregoritsch, Ruth Machell Julianelle +5 more |
2006-11-21 |
| 6951775 |
Method for forming interconnects on thin wafers |
Leonard Gardecki, James R. Palmer, Erik M. Probstfield |
2005-10-04 |
| 6706621 |
Wafer integrated rigid support ring |
Harry D. Cox, David Daniel, Leonard Gardecki, Albert Gregoritsch, Ruth Machell Julianelle +5 more |
2004-03-16 |
| 5719070 |
Metallization composite having nickel intermediate/interface |
Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, William T. Motsiff |
1998-02-17 |
| 5457345 |
Metallization composite having nickle intermediate/interface |
Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, William T. Motsiff |
1995-10-10 |
| 5251806 |
Method of forming dual height solder interconnections |
Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more |
1993-10-12 |
| 5130779 |
Solder mass having conductive encapsulating arrangement |
Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more |
1992-07-14 |
| 5104695 |
Method and apparatus for vapor deposition of material onto a substrate |
Stuart E. Greer, Eric Ernest Millham |
1992-04-14 |
