Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 | |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more | 2022-11-08 | $15,080,000 |