RS

Rainer Markus Schaller

Infineon Technologies Ag: 46 patents #75 of 7,486Top 2%
📍 Saal an der Donau, DE: #1 of 1 inventorsTop 100%
Overall (All Time): #61,401 of 4,157,543Top 2%
46
Patents All Time

Issued Patents All Time

Showing 26–46 of 46 patents

Patent #TitleCo-InventorsDate
11444007 Semiconductor device with galvanically isolated semiconductor chips 2022-09-13
11385301 Sensor devices having a sensor chip and busbar Juergen Hoegerl, Volker Strutz 2022-07-12
11326910 Sensor package and method for producing a sensor package Volker Strutz 2022-05-10
11289353 Hermetically sealed housing with a semiconductor component and method for manufacturing thereof Horst Theuss 2022-03-29
11275110 Semiconductor package with predictive safety guard Klaus Elian 2022-03-15
11255824 Photoacoustic sensor module and assembly Horst Theuss 2022-02-22
11211551 Current sensor package with continuous insulation Volker Strutz 2021-12-28
11105776 Detector module for a photo-acoustic gas sensor Horst Theuss 2021-08-31
11073572 Current sensor device with a routable molded lead frame Jochen Dangelmaier 2021-07-27
10852363 Side-biased current sensor with improved dynamic range Klaus Elian 2020-12-01
10782270 Photoacoustic gas sensor package Horst Theuss, Thomas Mueller 2020-09-22
10649010 Current sensing Wolfgang Raberg, Goran Keser, Matthias Rose 2020-05-12
10505102 Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole Volker Strutz, Klaus Elian, Cyrus Ghahremani 2019-12-10
10451543 Integrated photo-acoustic gas sensor module Thomas Mueller, Horst Theuss, Klaus Elian, Stefan Kolb 2019-10-22
10304795 Semiconductor device including antistatic die attach material Volker Strutz, Franz-Peter Kalz 2019-05-28
10241088 Photo-acoustic gas sensor module having light emitter and detector units Horst Theuss, Gottfried Beer, Sebastian Beer, Alfons Dehe, Franz Jost +2 more 2019-03-26
10180468 Chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package Goran Keser, Manuel Harrant 2019-01-15
10168391 Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more 2019-01-01
9741677 Semiconductor device including antistatic die attach material Volker Strutz, Franz-Peter Kalz 2017-08-22
9728493 Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same Volker Strutz 2017-08-08
9564578 Semiconductor package with integrated magnetic field sensor Thorsten Meyer, Martin Gruber, Franz Jost, Stefan Mieslinger, Liu Chen +4 more 2017-02-07