Issued Patents All Time
Showing 26–50 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928590 | Integrated circuit package with a heat dissipation device | Andreas Wolter, Matthias Georgi | 2011-04-19 |
| 7919868 | Carrier substrate and integrated circuit | Thorsten Meyer | 2011-04-05 |
| 7911068 | Component and method for producing a component | Thorsten Meyer, Markus Brunnbauer | 2011-03-22 |
| 7884488 | Semiconductor component with improved contact pad and method for forming the same | — | 2011-02-08 |
| 7867817 | Method for manufacturing a wafer level package | Stephan Dobritz, Henning Mieth | 2011-01-11 |
| 7847415 | Method for manufacturing a multichip module assembly | Roland Irsigler | 2010-12-07 |
| 7829380 | Solder pillar bumping and a method of making the same | Roland Irsigler | 2010-11-09 |
| 7820482 | Method of producing an electronic component with flexible bonding | Alfred Haimerl | 2010-10-26 |
| 7663248 | Flip-chip component | Thorsten Meyer | 2010-02-16 |
| 7646090 | Semiconductor module for making electrical contact with a connection device via a rewiring device | Roland Irsigler, Thorsten Meyer | 2010-01-12 |
| 7605019 | Semiconductor device with stacked chips and method for manufacturing thereof | Juergen Simon | 2009-10-20 |
| 7545048 | Stacked die package | Torsten Meyer | 2009-06-09 |
| 7517727 | Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement | Anton Legen | 2009-04-14 |
| 7514273 | Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel | Jens Pohl, Holger Woerner | 2009-04-07 |
| 7422930 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Jens Pohl | 2008-09-09 |
| 7365438 | Semiconductor device with semiconductor components connected to one another | Simon Muff | 2008-04-29 |
| 7340826 | Method for producing an electronic device connected to a printed circuit board | Jörg Zapf | 2008-03-11 |
| 7342320 | Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly | Ingo Wennemuth | 2008-03-11 |
| 7338843 | Method for producing an electronic component, especially a memory chip | Roland Irsigler, Barbara Vasquez | 2008-03-04 |
| 7326592 | Stacked die package | Torsten Meyer | 2008-02-05 |
| 7312533 | Electronic component with flexible contacting pads and method for producing the electronic component | Alfred Haimerl, Jens Pohl | 2007-12-25 |
| 7274110 | Semiconductor component having a CSP housing | Thorsten Meyer | 2007-09-25 |
| 7274107 | Semiconductor device | Thorsten Meyer, Andreas Wolter | 2007-09-25 |
| 7265451 | Semiconductor and method for producing a semiconductor | Roland Irsigler | 2007-09-04 |
| 7247948 | Semiconductor device and method for fabricating the semiconductor device | Roland Irsigler, Thorsten Meyer | 2007-07-24 |