Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7221053 | Integrated device and electronic system | Thorsten Meyer, Stephan Dobritz | 2007-05-22 |
| 7217646 | Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement | Thorsten Meyer | 2007-05-15 |
| 7211451 | Process for producing a component module | Thorsten Meyer, Gerd Frankowsky, Barbara Vasquez, Roland Irsigler | 2007-05-01 |
| 7211472 | Method for producing a multichip module and multichip module | Roland Irsigler | 2007-05-01 |
| 7208345 | Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device | Thorsten Meyer | 2007-04-24 |
| 7087512 | Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions | Roland Irsigler, Thorsten Meyer, Barbara Vasquez | 2006-08-08 |
| 7080988 | Flexible contact-connection device | Roland Irsigler, Thorsten Meyer, Andreas Wolter | 2006-07-25 |
| 7074649 | Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit | Roland Irsigler, Thorsten Meyer | 2006-07-11 |
| 7074696 | Semiconductor circuit module and method for fabricating semiconductor circuit modules | Gerd Frankowsky, Barbara Vasquez | 2006-07-11 |
| 7037761 | Method of producing an electronic component | Bernd Römer | 2006-05-02 |
| 7022549 | Method for connecting an integrated circuit to a substrate and corresponding arrangement | Roland Irsigler, Thorsten Meyer | 2006-04-04 |
| 6979591 | Connection of integrated circuits | Roland Irsigler, Jens Pohl | 2005-12-27 |
| 6956287 | Electronic component with flexible bonding pads and method of producing such a component | Alfred Haimerl | 2005-10-18 |
| 6953708 | Method of producing a semiconductor component having a compliant buffer layer | Thorsten Meyer, Barbara Vasquez | 2005-10-11 |
| 6936928 | Semiconductor component and method for its production | Thorsten Meyer | 2005-08-30 |
| 6927157 | Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device | Thorsten Meyer | 2005-08-09 |
| 6919232 | Process for producing a semiconductor chip | Roland Irsigler, Barbara Vasquez | 2005-07-19 |
| 6916185 | Connection of integrated circuit to a substrate | Barbara Vasquez | 2005-07-12 |
| 6905954 | Method for producing a semiconductor device and corresponding semiconductor device | Thorsten Meyer, Barbara Vasquez | 2005-06-14 |
| 6897088 | Method for connecting circuit devices | Roland Irsigler, Jens Pohl | 2005-05-24 |
| 6897568 | Electronic component with flexible contacting pads and method for producing the electronic component | Alfred Haimerl, Jens Pohl | 2005-05-24 |
| 6888256 | Compliant relief wafer level packaging | Thorsten Meyer, Barbara Vasquez | 2005-05-03 |
| 6887777 | Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement | — | 2005-05-03 |
| 6864575 | Electronic interface structures and methods | Thorsten Meyer | 2005-03-08 |
| 6861291 | Method producing a contact connection between a semiconductor chip and a substrate and the contact connection | Barbara Vasquez, Roland Irsigler | 2005-03-01 |