Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6858799 | Electronic component with a semiconductor chip and method of producing the electronic component | Bernd Römer | 2005-02-22 |
| 6852931 | Configuration having an electronic device electrically connected to a printed circuit board | Jörg Zapf | 2005-02-08 |
| 6851598 | Electronic component with a semiconductor chip and method for producing the electronic component | Uta Gebauer, Jürgen Högerl, Volker Strutz | 2005-02-08 |
| 6845554 | Method for connection of circuit units | Gerd Frankowsky, Roland Irsigler, Thorsten Meyer, Barbara Vasquez | 2005-01-25 |
| 6826037 | Electronic structure | Thorsten Meyer, Barbara Vasquez | 2004-11-30 |
| 6807064 | Electronic component with at least one semiconductor chip and method for producing the electronic component | Thorsten Meyer | 2004-10-19 |
| 6756540 | Self-adhering chip | Barbara Vasquez | 2004-06-29 |
| 6744127 | Semiconductor chip, memory module and method for testing the semiconductor chip | Jochen Müller, Barbara Vasquez | 2004-06-01 |
| 6727576 | Transfer wafer level packaging | Thorsten Meyer, Barbara Vasquez | 2004-04-27 |
| 6714418 | Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another | Gerd Frankowsky, Roland Irsigler, Thorsten Meyer, Barbara Vasquez | 2004-03-30 |
| 6664176 | Method of making pad-rerouting for integrated circuit chips | Thorsten Meyer, Stefan Ruckmich, Barbara Vasquez | 2003-12-16 |
| 6638870 | Forming a structure on a wafer | Axel Brintzinger, Barbara Vasquez | 2003-10-28 |
| 6630723 | Laser programming of integrated circuits | Roland Irsigler | 2003-10-07 |
| 6555415 | Electronic configuration with flexible bonding pads | — | 2003-04-29 |
| 6406937 | Method for producing an electrical connection between the front and rear sides of semiconductor chips | — | 2002-06-18 |