Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867817 | Method for manufacturing a wafer level package | Stephan Dobritz, Harry Hedler | 2011-01-11 |
| 7326593 | Method of producing a package for semiconductor chips | Andreas Bischof, Knut Kahlisch | 2008-02-05 |
| 6979887 | Support matrix with bonding channel for integrated semiconductors, and method for producing it | Knut Kahlisch | 2005-12-27 |
| 6605864 | Support matrix for integrated semiconductors, and method for producing it | Knut Kahlisch | 2003-08-12 |