Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7518220 | Substrate for an FBGA semiconductor component | Steffen Kroehnert, Wieland Wahrmund | 2009-04-14 |
| 7326593 | Method of producing a package for semiconductor chips | Andreas Bischof, Henning Mieth | 2008-02-05 |
| 6979887 | Support matrix with bonding channel for integrated semiconductors, and method for producing it | Henning Mieth | 2005-12-27 |
| 6946721 | Leadframe of a conductive material and component with a leadframe of a conductive material | Stephan Dobritz, Steffen Kröhnert | 2005-09-20 |
| 6724076 | Package for a semiconductor chip | Volker Strutz | 2004-04-20 |
| 6605864 | Support matrix for integrated semiconductors, and method for producing it | Henning Mieth | 2003-08-12 |